The prime objective of this report is to provide the insights on the post COVID-19 impact wwhich will help market players in this field evaluate their business approaches. Also, this report covers market segmentation by major market verdors, types, applications/end users and geography(North America, East Asia, Europe, South Asia, Southeast Asia, Middle East, Africa, Oceania, South America).

Die-attach are the term reserved for processes where the face of a die is attached to a substrate by a single joint.For power and high-power applications, die-attach products are made of high-lead solder alloys, which fulfill the requirements of high melting temperature and adequate thermo-mechanical properties, to ensure lifetime package reliability. However, die-attach processes parameters must be adapted for each application to achieve optimal results. In global market, the production of Die Attach Materials increases from 21165 MT in 2012 to 26131MT in 2016, at a CAGR of 5.41%. In 2016, the global Die Attach Materials market is led by China, capturing about 43.63% of global Die Attach Materials production. Europe is the second-largest region-wise market with 6.51% global production share. At present, the major manufacturers of Die Attach Materials are SMIC, Henkel, Shenzhen Vital New Material, Indium, Alpha Assembly Solutions, TONGFANG TECH, Umicore. SMIC is the world leader, holding 7.34% production market share in 2016. In application, Die Attach Materials downstream is wide and recently Die Attach Materials has acquired increasing significance in various fields of Consumer Electronics, Automotive, Medical, Telecommunications and others. Globally, the Die Attach Materials market is mainly driven by growing demand for Consumer Electronics which accounts for nearly 79.19% of total downstream consumption of Die Attach Materials in global. In the future, global market is expected to witness significant growth on account of rising applications, so in the next few years, Die Attach Materials production will show a trend of steady growth. In 2022 the production of Die Attach Materials is estimated to be 35809 MT.

By Market Verdors:

 

  • SMIC
  • Henkel
  • Shenzhen Vital New Material
  • Indium
  • Alpha Assembly Solutions
  • TONGFANG TECH
  • Umicore
  • Heraeu
  • AIM
  • TAMURA RADIO
  • Kyocera
  • Shanghai Jinji
  • Palomar Technologies
  • Nordson EFD
  • DowDuPont

By Types:

  • Die Attach Paste
  • Die Attach Wire

By Applications:

  • Consumer Electronics
  • Automotive
  • Medical
  • Telecommunications

Key Indicators Analysed

  • Market Players & Competitor Analysis: The report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2016-2027 & Sales with a thorough analysis of the market’s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.
  • Global and Regional Market Analysis: The report includes Global & Regional market status and outlook 2016-2027. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.
  • Market Trends: Market key trends which include Increased Competition and Continuous Innovations.
  • Opportunities and Drivers: Identifying the Growing Demands and New Technology
  • Porters Five Force Analysis: The report provides with the state of competition in industry depending on five basic forces: threat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.

Key Reasons to Purchase

  • To gain insightful analyses of the market and have comprehensive understanding of the global market and its commercial landscape.
  • Assess the production processes, major issues, and solutions to mitigate the development risk.
  • To understand the most affecting driving and restraining forces in the market and its impact in the global market.
  • Learn about the market strategies that are being adopted by leading respective organizations.
  • To understand the future outlook and prospects for the market.
  • Besides the standard structure reports, we also provide custom research according to specific requirements

Table of content

1 Report Overview

1.1 Study Scope

1.2 Key Market Segments

1.3 Players Covered: Ranking by Die-Attach Materials Revenue

1.4 Market Analysis by Type

1.4.1 Global Die-Attach Materials Market Size Growth Rate by Type: 2021 VS 2027

1.4.2 Die Attach Paste

1.4.3 Die Attach Wire

1.5 Market by Application

1.5.1 Global Die-Attach Materials Market Share by Application: 2022-2027

1.5.2 Consumer Electronics

1.5.3 Automotive

1.5.4 Medical

1.5.5 Telecommunications

1.6 Study Objectives

1.7 Years Considered

1.8 Overview of Global Die-Attach Materials Market

1.8.1 Global Die-Attach Materials Market Status and Outlook (2016-2027)

1.8.2 North America

1.8.3 East Asia

1.8.4 Europe

1.8.5 South Asia

1.8.6 Southeast Asia

1.8.7 Middle East

1.8.8 Africa

1.8.9 Oceania

1.8.10 South America

1.8.11 Rest of the World

2 Market Competition by Manufacturers

2.1 Global Die-Attach Materials Production Capacity Market Share by Manufacturers (2016-2021)

2.2 Global Die-Attach Materials Revenue Market Share by Manufacturers (2016-2021)

2.3 Global Die-Attach Materials Average Price by Manufacturers (2016-2021)

2.4 Manufacturers Die-Attach Materials Production Sites, Area Served, Product Type

3 Sales by Region

3.1 Global Die-Attach Materials Sales Volume Market Share by Region (2016-2021)

3.2 Global Die-Attach Materials Sales Revenue Market Share by Region (2016-2021)

3.3 Nort

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